1 November 2004 10-Gbytes/s, three-dimensional parallel optical interconnects using a novel conductive polymer flip-chip process
Author Affiliations +
Abstract
Micro-optics offers the ability to realize massively parallel, surface-normal interconnects at the chip scale. In this context, we investigate the integration of a 10-Gbytes/s, 850-nm vertical-cavity surface-emitting laser (VCSEL) with a 2×2 array of continuous surface profile, diffractive optical elements to demonstrate a prototype system that incorporates 3-D, highly dense, parallel optical interconnects. The integration is achieved using a novel conductive polymer-based flip-chip process, which is implemented using conventional fabrication techniques. We present experimental results from the design, fabrication, integration, and characterization of the prototype system.
©(2004) Society of Photo-Optical Instrumentation Engineers (SPIE)
Saurabh K. Lohokare, Christopher A. Schuetz, Zhaolin Lu, Thomas E. Dillon, Anita Sure, and Dennis W. Prather "10-Gbytes/s, three-dimensional parallel optical interconnects using a novel conductive polymer flip-chip process," Optical Engineering 43(11), (1 November 2004). https://doi.org/10.1117/1.1803555
Published: 1 November 2004
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KEYWORDS
Polymers

Vertical cavity surface emitting lasers

Diffractive optical elements

Optical interconnects

Glasses

System integration

Optical lithography

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