Special Section on Applications of Laser Ablation and Micromachining

Ultraviolet laser ablation patterning of oxide films for optical applications

[+] Author Affiliations
Ju¨rgen Ihlemann

Laser-Laboratorium Go¨ttingen e.V., Hans-Adolf-Krebs-Weg 1, 37077 Go¨ttingen, Germany E-mail: jihle@llg.gwdg.de

Opt. Eng. 44(5), 051108 (May 10, 2005). doi:10.1117/1.1904602
History: Received Mar. 22, 2005; Accepted Sep. 24, 2004; May 10, 2005; Online May 10, 2005
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Deep-UV (248 nm, 193 nm) excimer laser ablation is used to pattern thin oxide films or layer stacks. The ablation of extended areas as well as submicrometer structuring is possible. Due to their optical, chemical, and thermal stability, these inorganic films are better suited for optical applications compared to organic films, especially if UV transparency is required. The ablation of SiO2,Al2O3,HfO2, and Ta2O5 layers and combinations is investigated. Patterned films can be used as masks, diffractive phase elements, or gratings. © 2005 Society of Photo-Optical Instrumentation Engineers.

© 2005 Society of Photo-Optical Instrumentation Engineers

Citation

Ju¨rgen Ihlemann
"Ultraviolet laser ablation patterning of oxide films for optical applications", Opt. Eng. 44(5), 051108 (May 10, 2005). ; http://dx.doi.org/10.1117/1.1904602


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