Materials, Photonic Devices, and Sensors

Thermally stable conformal encapsulation material for high-power ultraviolet light-emitting diodes

[+] Author Affiliations
Shun-Yuan Huang, Jau-Sheng Wang

National Sun Yat-sen University, Department of Photonics, Kaohsiung, Taipei, Taiwan

Opt. Eng. 56(7), 077105 (Jul 12, 2017). doi:10.1117/1.OE.56.7.077105
History: Received May 6, 2017; Accepted June 27, 2017
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Abstract.  A conformal encapsulation material for use in high-power, thermally stable ultraviolet (UV) light-emitting diodes was successfully developed. For silicone, thermal degradation started at 200°C, and the transmittance was 85.5% at 365 nm. The transmittance decreased by 55% after thermal aging at 250°C for 72 h and it decreased further by 2.5%, even at room temperature, under continuous exposure to UV light at 365 nm for 72 h. By contrast, for the sol–gel material, thermal degradation started at 300°C, and the transmittance was 90% at 365 nm. The transmittance decreased negligibly after thermal aging at 250°C for 72 h and it did not decrease further even at 75°C under continuous exposure to UV light at 365 nm for 72 h.

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© 2017 Society of Photo-Optical Instrumentation Engineers

Citation

Shun-Yuan Huang and Jau-Sheng Wang
"Thermally stable conformal encapsulation material for high-power ultraviolet light-emitting diodes", Opt. Eng. 56(7), 077105 (Jul 12, 2017). ; http://dx.doi.org/10.1117/1.OE.56.7.077105


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