Infrared Thermography As An Aid In Quantitative Reliability And Risk Analyses

Angel Madrid

doi:10.1117/12.945601

3 October 1988 Infrared Thermography As An Aid In Quantitative Reliability And Risk Analyses

Angel Madrid

Proceedings Volume 0918, Applications of Infrared Technology; (1988) https://doi.org/10.1117/12.945601
Event: Sira/SPIE Infrared Meeting, 1988, London, United Kingdom

Abstract

An attempt is made to show how Infrared Thermography may effectively aid in yielding realistic assessments of both hardware and human reliability parameters, such as failure/ error rates, corresponding to working conditions actually sensitive to and/or reflected in the existing thermal environment, which usually are not explicitly and specifically accounted for in current quantitative reliability and risk analyses. An analysis, emphasizing first principles and measurable phenomena, is made conducive to characterize specific functional relationships between the relevant thermal patterns and those reliability parameters which may lead to the actual assessment of the latter. The application of this analysis to fault/failure mode diagnosis, and both preventive maintenance and risk analysis is also addressed.

Citation Download Citation

Angel Madrid "Infrared Thermography As An Aid In Quantitative Reliability And Risk Analyses", Proc. SPIE 0918, Applications of Infrared Technology, (3 October 1988); https://doi.org/10.1117/12.945601

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