Array high-sensitivity room temperature coil system for SNMR detection in shallow depth

Tingting Lin; Kunyu Xie; Siyuan Zhang; Jing Zhao; Jun Lin

doi:10.1117/12.2265823

23 January 2017 Array high-sensitivity room temperature coil system for SNMR detection in shallow depth

Tingting Lin, Kunyu Xie, Siyuan Zhang, Jing Zhao, Jun Lin

Proceedings Volume 10322, Seventh International Conference on Electronics and Information Engineering; 1032211 (2017) https://doi.org/10.1117/12.2265823
Event: Seventh International Conference on Electronics and Information Engineering, 2016, Nanjing, China

Abstract

The noninvasive method of surface nuclear magnetic resonance (SNMR) is a geophysical technique that is directly sensitive to hydrogen protons, besides it can exploit the NMR phenomenon for a quantitative determination of the subsurface groundwater distribution. Traditionally, SNMR utilizes large surface coils for both transmitting excitation pulses and recording the groundwater response. While, in recent research, a low Tc-SQUIDs is taken as a new sensor to replace the large receiving coil (Rx), which performing the best sensitivity for the shallow depth. Nevertheless, SQUID is with the problems of flux trapping and operational difficulties. In this paper, we introduce a room temperature coil system. A Cu coil with diameter of 1 m and a low noise preamplifier was systematically investigated and reached a sensitivity of 0.2fT/Hz^1/2.Four preamplifiers are chosen for optimizing the pickup coils. The resolution studies for the array coil systems were performed, and the optimum distance between the adjacent pickup coils to achieve a better experimental results especially for the shallow depth. Our study enable the further use of the room temperature coil for SNMR shallow depth detections.

Citation Download Citation

Tingting Lin, Kunyu Xie, Siyuan Zhang, Jing Zhao, and Jun Lin "Array high-sensitivity room temperature coil system for SNMR detection in shallow depth", Proc. SPIE 10322, Seventh International Conference on Electronics and Information Engineering, 1032211 (23 January 2017); https://doi.org/10.1117/12.2265823

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