Optimization of femtosecond laser micromachining of polylactide and PLLA/HAp composite

Bogusz D. Stępak; Konrad Szustakiewicz; Arkadiusz J. Antończak

doi:10.1117/12.2296433

19 February 2018 Optimization of femtosecond laser micromachining of polylactide and PLLA/HAp composite

Bogusz D. Stępak, Konrad Szustakiewicz, Arkadiusz J. Antończak

Proceedings Volume 10520, Laser-based Micro- and Nanoprocessing XII; 105201V (2018) https://doi.org/10.1117/12.2296433
Event: SPIE LASE, 2018, San Francisco, California, United States

Abstract

This paper presents results of poly(L-lactide) and poly(L-lactide)/hydroxyapatite composite cutting optimization using 2^nd harmonic of femtosecond fiber laser. There are several limitations regarding the use of femtosecond lasers for processing of heat-sensitive medical grade polymers such as poly(L-lactide) (PLLA). Improper use of ultrashort pulse laser may lead to heat load into surrounding material causing its melting and crack formation when excessive energy is deposited and pulse repetition frequency is too high. The optimization of laser parameters is necessary not only because of heat but also due to reflection and scattering of incident light in high aspect ratio V-shaped groove resulting in decrease of ablation rate with an increasing number of repetitions. This problem is especially important in case of polymer foils thicker than 200 μm and the beam spot size which is typically around 15 - 30 μm in commercial systems. In this work we present threshold fluence and ablation rates for three types of material: amorphous PLLA, crystalline PLLA and PLLA/hydroxyapatite composite. For those materials in form of thick foils (∼400 μm) we performed cutting optimization. A significant improvement of cutting efficiency in case of thick foils was made by applying a method of multiple, overlapped cuts.

Citation Download Citation

Bogusz D. Stępak, Konrad Szustakiewicz, and Arkadiusz J. Antończak "Optimization of femtosecond laser micromachining of polylactide and PLLA/HAp composite", Proc. SPIE 10520, Laser-based Micro- and Nanoprocessing XII, 105201V (19 February 2018); https://doi.org/10.1117/12.2296433

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