Paper
31 July 1989 Optical Techniques For In-Plane Strain Measurement In An Industrial Environment
J. B. Brownell, R. J. Parker
Author Affiliations +
Proceedings Volume 1084, Stress and Vibration: Recent Developments in Industrial Measurement and Analysis; (1989) https://doi.org/10.1117/12.952900
Event: Sira/Stress and Vibration: Recent Developments in Measurement and Analysis, 1989, London, United Kingdom
Abstract
A wide variety of optical techniques are available for making full field qualitative measurements of surface displacement. Their application to actual problems in an industrial environment leads to new and often unforeseen difficulties. This paper will describe recent experience gained using holographic interferometry, electronic speckle pattern interferometry CESPI), moire interferometry, and high resolution moire photography for measuring in-plane displacement, and hence strain. Work has been carried out in engineering studies and laboratory exercises, making direct comparisons between the techniques in order to highlight their relative merits in different applications.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. B. Brownell and R. J. Parker "Optical Techniques For In-Plane Strain Measurement In An Industrial Environment", Proc. SPIE 1084, Stress and Vibration: Recent Developments in Industrial Measurement and Analysis, (31 July 1989); https://doi.org/10.1117/12.952900
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KEYWORDS
Fringe analysis

Interferometry

Holography

Industrial metrology

Diffraction gratings

Holographic interferometry

Deflectometry

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