Piezoelectric wafer active sensors for sensing acoustic emission due to crack rubbing/clapping

Roshan Joseph; Md Yeasin Bhuiyan; Victor Giurgiutiu

doi:10.1117/12.2515314

21 March 2019 Piezoelectric wafer active sensors for sensing acoustic emission due to crack rubbing/clapping

Roshan Joseph, Md Yeasin Bhuiyan, Victor Giurgiutiu

Proceedings Volume 10967, Active and Passive Smart Structures and Integrated Systems XIII; 109672A (2019) https://doi.org/10.1117/12.2515314
Event: SPIE Smart Structures + Nondestructive Evaluation, 2019, Denver, Colorado, United States

Abstract

Crack rubbing or clapping in metallic structures generates acoustic emission (AE) signals. Such AE signals need to be distinguished from AE signal due to fatigue crack growth event. AE signal due to crack rubbing or clapping of fatigue generated crack was studied for a plate specimen. 20 mm fatigue crack was generated in a 1 mm thick aluminum plate specimen. Vibration-induced excitation was performed on the specimen to induce crack faying surface-motion for AE signal generation. Various specimen resonances have different crack faying surface motions, which were studied from FEM analysis. Modeshapes and crack faying surface motions of the specimen are studied at 35 Hz and 180 Hz specimen resonances. AE signals at various specimen resonances were recorded by piezoelectric wafer active sensors (PWAS) and the recorded waveforms are analyzed to obtain AE signatures. At various specimen resonances, AE signals have different signatures due to the change in crack faying surface motions. AE recording was done by using multiple PWAS sensors placed at various distances from the crack. The difference in AE signals close to crack and distant from crack as well as the geometric spreading of AE signals originating due to crack rubbing was studied from multi-sensor experiments.

Citation Download Citation

Roshan Joseph, Md Yeasin Bhuiyan, and Victor Giurgiutiu "Piezoelectric wafer active sensors for sensing acoustic emission due to crack rubbing/clapping", Proc. SPIE 10967, Active and Passive Smart Structures and Integrated Systems XIII, 109672A (21 March 2019); https://doi.org/10.1117/12.2515314

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