Paper
19 November 2021 Spectrally resolved interferometry to measure thickness and refractive index of transparent material
Author Affiliations +
Proceedings Volume 12059, Tenth International Symposium on Precision Mechanical Measurements; 1205910 (2021) https://doi.org/10.1117/12.2612024
Event: Tenth International Symposium on Precision Mechanical Measurements, 2021, Qingdao, China
Abstract
We demonstrate a method for simultaneous measurement of thickness and refractive index of transparent materials based on spectrally-resolved interferometry. By extracting the phase from the interference spectrum, the measured optical path difference can be obtained directly without phase shift device in the measurable range. This unique advantage makes it capable of measuring physical thickness and refractive index by introducing transparent medium and processing three useful optical path differences. In the long-term stability test, the repeatability experiment of spectral resolution interferometric ranging technology using femtosecond laser is carried out within 60 min, and the standard deviation is 341nm.
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Jing Wang, Yang Lu, Xiongxin Sun, and Liandong Yu "Spectrally resolved interferometry to measure thickness and refractive index of transparent material", Proc. SPIE 12059, Tenth International Symposium on Precision Mechanical Measurements, 1205910 (19 November 2021); https://doi.org/10.1117/12.2612024
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KEYWORDS
Refractive index

Wafer-level optics

Semiconducting wafers

Silicon

Fourier transforms

Interferometry

Polishing

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