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Teledyne e2v develops silicon sensors for ground and space-based Astronomy applications. Multiple new back-side illuminated (BSI) CMOS and CCD sensors are presented, such as the large area CMOS platform. Teledyne’s sensors are also supported by advances in back-thinning capabilities. Teledyne has upgraded the operation to process 8” wafers with optimised anti-reflection coatings for applications from UV to NIR. The new 8” process is enabling back-thinning of the wafer-scale large area CMOS product family and the latest AR coatings use novel technology to achieve high stable QE performance at VUV and UV wavelengths.
Katherine A. Lawrie,Gabriela Druitt,Paul Jerram, andJérôme Pratlong
"Silicon sensor capabilities at Teledyne e2v for visible, NIR, UV and x-ray applications", Proc. SPIE 12191, X-Ray, Optical, and Infrared Detectors for Astronomy X, 1219102 (29 August 2022); https://doi.org/10.1117/12.2630167
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Katherine A. Lawrie, Gabriela Druitt, Paul Jerram, Jérôme Pratlong, "Silicon sensor capabilities at Teledyne e2v for visible, NIR, UV and x-ray applications," Proc. SPIE 12191, X-Ray, Optical, and Infrared Detectors for Astronomy X, 1219102 (29 August 2022); https://doi.org/10.1117/12.2630167