Presentation + Paper
29 August 2022 Silicon sensor capabilities at Teledyne e2v for visible, NIR, UV and x-ray applications
Katherine A. Lawrie, Gabriela Druitt, Paul Jerram, Jérôme Pratlong
Author Affiliations +
Abstract
Teledyne e2v develops silicon sensors for ground and space-based Astronomy applications. Multiple new back-side illuminated (BSI) CMOS and CCD sensors are presented, such as the large area CMOS platform. Teledyne’s sensors are also supported by advances in back-thinning capabilities. Teledyne has upgraded the operation to process 8” wafers with optimised anti-reflection coatings for applications from UV to NIR. The new 8” process is enabling back-thinning of the wafer-scale large area CMOS product family and the latest AR coatings use novel technology to achieve high stable QE performance at VUV and UV wavelengths.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Katherine A. Lawrie, Gabriela Druitt, Paul Jerram, and Jérôme Pratlong "Silicon sensor capabilities at Teledyne e2v for visible, NIR, UV and x-ray applications", Proc. SPIE 12191, X-Ray, Optical, and Infrared Detectors for Astronomy X, 1219102 (29 August 2022); https://doi.org/10.1117/12.2630167
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Sensors

Charge-coupled devices

CMOS sensors

CCD image sensors

Quantum efficiency

Antireflective coatings

Astronomy

RELATED CONTENT


Back to Top