Method to reduce the smile of high-power diode laser bar by balancing the thermal-induced stress

Tingyu Si; Xuyan Zhou; Yangqing Wu; Jianxin Zhang; Tongtong Li; Yi Jiang

doi:10.1117/12.2643954

27 December 2022 Method to reduce the smile of high-power diode laser bar by balancing the thermal-induced stress

Tingyu Si, Xuyan Zhou, Yangqing Wu, Jianxin Zhang, Tongtong Li, Yi Jiang

Proceedings Volume 12311, Semiconductor Lasers and Applications XII; 123110C (2022) https://doi.org/10.1117/12.2643954
Event: SPIE/COS Photonics Asia, 2022, Online Only

Abstract

The smile effect of the laser bar increases the difficulty of laser beam coupling and limits its application. In this paper, the smile effect in the high-power laser on the microchannel cooler (MCC) and the method of reducing the smile effect by balancing the thermal-induced stress are studied. The model of diode laser packaging with MCC is established based on the finite-element method (FEM). The effect of the thickness of the N-foil on the smile effect and stress is analyzed. The bar is bent into a convex shape after the bar is bonded to the heat sink, according to the simulation. With the increase of the thickness of the N-foil, the bar deformation gradually decreases, and then the middle part of the bar reversely increases. The thermal-induced stress on the bar is balanced by optimizing the thickness of the N-foil. The minimum deformation was less than 0.2 μm.

Conference Presentation

Citation Download Citation

Tingyu Si, Xuyan Zhou, Yangqing Wu, Jianxin Zhang, Tongtong Li, and Yi Jiang "Method to reduce the smile of high-power diode laser bar by balancing the thermal-induced stress", Proc. SPIE 12311, Semiconductor Lasers and Applications XII, 123110C (27 December 2022); https://doi.org/10.1117/12.2643954

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