Measurement of transparent profile using multispectral 3D digital image correlation

Xinqiao Tang; Xiaowen Li; Zhenning Chen; Wei Sun

doi:10.1117/12.2667090

27 January 2023 Measurement of transparent profile using multispectral 3D digital image correlation

Xinqiao Tang, Xiaowen Li, Zhenning Chen, Wei Sun

Proceedings Volume 12550, International Conference on Optical and Photonic Engineering (icOPEN 2022); 1255018 (2023) https://doi.org/10.1117/12.2667090
Event: International Conference on Optical and Photonic Engineering (icOPEN 2022), 2022, ONLINE, China

Abstract

Three-dimensional (3D) digital image correlation (DIC) based on fluorescent speckle pattern is becoming popular for measuring 3D profiles and deformations. However, the simultaneous monitoring of both the front and rear surfaces remains challenging due to the different refractive indexes of light in different media. In this study, we utilized a multispectral 3D DIC method using fluorescent speckle patterns and a 3CCD camera for the front and rear surfaces measurement of transparent objects. Fluorescent speckle patterns excited red or blue light were sprayed on the interested surfaces before measurement. Then, the red channel and blue channel sub-systems of a virtual 3D DIC system with a 3CCD camera were used to simultaneously capture both the front and back surfaces, respectively. To unify the sub coordinate systems of different channels, a calibration model of the 3CCD camera considering the sensor designed optical path difference (OPD) was proposed. Furthermore, profile reconstruction was corrected based on Snell's law to eliminate the refractive distortion caused by the different refractive indexes. The experimental results of transparent flat and curved objects showed that the accuracy of this method was significantly improved.

Citation Download Citation

Xinqiao Tang, Xiaowen Li, Zhenning Chen, and Wei Sun "Measurement of transparent profile using multispectral 3D digital image correlation", Proc. SPIE 12550, International Conference on Optical and Photonic Engineering (icOPEN 2022), 1255018 (27 January 2023); https://doi.org/10.1117/12.2667090

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KEYWORDS

Digital image correlation

Cameras

Image sensors

3D modeling

3D metrology

Calibration

Imaging systems

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