Application of optical scattering in multichip module processing

Meirong Tu; Yang Xu; Peter J. Gielisse; Igor F. Kulisic

doi:10.1117/12.218341

1 September 1995 Application of optical scattering in multichip module processing

Meirong Tu, Yang Xu, Peter J. Gielisse, Igor F. Kulisic

Proceedings Volume 2541, Optical Scattering in the Optics, Semiconductor, and Computer Disk Industries; (1995) https://doi.org/10.1117/12.218341
Event: SPIE's 1995 International Symposium on Optical Science, Engineering, and Instrumentation, 1995, San Diego, CA, United States

Abstract

The impact of surface characterization on various aspects of microelectronic device performance and manufacture is briefly reviewed. Optical scattering measurements have been carried out for the surface characterization of AlN, MgO, Al₂O₃ substrates, single crystal silicon wafers and physcial vapor deposited films. Scattering light was recorded up to 80 degree from the specular direction. The angle-resolved scattered light sensitively reveals the characteristics of surface in the spatial frequency domain. Quantitative parameters of surface roughness have been derived from power spectral density distributions and diffraction theory for highly polished smooth surfaces. Instrumentation for full surface characterization has been coupled with computer operation. It has the features of high-speed and noncontact and is inherently area averaging. It lends itself particularly well to online product of high- speed and inprocess monitoring of a manufacturing process. Delicate surfaces can be rapidly 'finger printed'.

Citation Download Citation

Meirong Tu, Yang Xu, Peter J. Gielisse, and Igor F. Kulisic "Application of optical scattering in multichip module processing", Proc. SPIE 2541, Optical Scattering in the Optics, Semiconductor, and Computer Disk Industries, (1 September 1995); https://doi.org/10.1117/12.218341

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