Thick-polysilicon-based surface micromachined capacitive accelerometer with force-feedback operation

Beatrice Wenk; J. Ramos-Martos; M. Fehrenbach; P. Lange; Michael Offenberg; Werner Riethmuller

doi:10.1117/12.221186

15 September 1995 Thick-polysilicon-based surface micromachined capacitive accelerometer with force-feedback operation

Beatrice Wenk, J. Ramos-Martos, M. Fehrenbach, P. Lange, Michael Offenberg, Werner Riethmuller

Proceedings Volume 2642, Micromachined Devices and Components; (1995) https://doi.org/10.1117/12.221186
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States

Abstract

This paper describes the concept, the design and measurement results of a surface micromachined accelerometer. For the accelerometer presented here a polysilicon high rate deposition process was used to fabricate polysilicon layers with a thickness of 10 micrometers . The sensor is designed as an interdigital finger structure forming a differential capacitor, where the moveable fingers are mounted on a moveable mass and the fixed electrodes are anchored on the substrate. The air gap between the fingers is 1 micrometers . A force-feedback operation mode is realized to increase the sensor performance. A two chip solution with sensing element and signal processing circuit on separate chips was chosen as first approach towards a monolithic integrated accelerometer. The evaluation circuit was realized in BiCMOS technology. Sensors with a closed-loop sensitivity of 8mV/g and a bandwidth of about 10kHz have been fabricated. A resolution of 0.1g and a linearity error of less than 1% could be achieved for a measurement range of +/- 100 g.

Citation Download Citation

Beatrice Wenk, J. Ramos-Martos, M. Fehrenbach, P. Lange, Michael Offenberg, and Werner Riethmuller "Thick-polysilicon-based surface micromachined capacitive accelerometer with force-feedback operation", Proc. SPIE 2642, Micromachined Devices and Components, (15 September 1995); https://doi.org/10.1117/12.221186

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