Optimization of microchannel heat sinks for high-power diode lasers in copper technology

Thomas Ebert; Jens Biesenbach; Hans-Georg Treusch; Peter Loosen; Reinhart Poprawe

doi:10.1117/12.281119

18 August 1997 Optimization of microchannel heat sinks for high-power diode lasers in copper technology

Thomas Ebert, Jens Biesenbach, Hans-Georg Treusch, Peter Loosen, Reinhart Poprawe

Proceedings Volume 3097, Lasers in Material Processing; (1997) https://doi.org/10.1117/12.281119
Event: Lasers and Optics in Manufacturing III, 1997, Munich, Germany

Abstract

Basis of the developments discussed in the presentation are 10 mm GaAs diode laser bars mounted on copper micro channel heat sinks. Optimizing the micro channel heat sinks leads to decreased thermal resistance and decreased pressure drop. In the presentation the steps to ten times reduced pressure drop and optical power output of the diode lasers of over 100 Watts will be described.

Citation Download Citation

Thomas Ebert, Jens Biesenbach, Hans-Georg Treusch, Peter Loosen, and Reinhart Poprawe "Optimization of microchannel heat sinks for high-power diode lasers in copper technology", Proc. SPIE 3097, Lasers in Material Processing, (18 August 1997); https://doi.org/10.1117/12.281119

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