Processing of free-space optical interconnect devices using solder engineering

Athanasios Dimoulas; Nickolaos E. Strifas; Robert H. Esser; Aristos Christou; Richard V. Stone; Christine T. Travers; Peter S. Guilfoyle; John M. Hessenbruch

doi:10.1117/12.307581

5 May 1998 Processing of free-space optical interconnect devices using solder engineering

Athanasios Dimoulas, Nickolaos E. Strifas, Robert H. Esser, Aristos Christou, Richard V. Stone, Christine T. Travers, Peter S. Guilfoyle, John M. Hessenbruch

Author Affiliations +

Proceedings Volume 3288, Optoelectronic Interconnects V; (1998) https://doi.org/10.1117/12.307581
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

A packaging technology for global (N⁴) free space optical interconnects has been developed and implemented by means of hybrid integration using solder engineering. Solder arrays, defined by photolithography and electrodeposition, are used to physically attach, optically align and electrically connect the microoptical components. A processing sequence has been fully developed for the fabrication of the emitter sub-assembly consist of 8 X 8 and 16 X 16 arrays of vertical cavity surface emitting lasers and diffractive optical interconnect elements. The first level of integration consisting of the metal signal lines, ground plane and solder arrays has been completed with excellent uniformity and yield of the deposited solder.

Citation Download Citation

Athanasios Dimoulas, Nickolaos E. Strifas, Robert H. Esser, Aristos Christou, Richard V. Stone, Christine T. Travers, Peter S. Guilfoyle, and John M. Hessenbruch "Processing of free-space optical interconnect devices using solder engineering", Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); https://doi.org/10.1117/12.307581

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