Optical chips interconnects: economically viable

Roger A. Vounckx; Paul L. Heremans; Daniel Coppee; Reiner Windisch; Gustaaf Borghs; Maarten Kuijk

doi:10.1117/12.328743

4 December 1998 Optical chips interconnects: economically viable

Roger A. Vounckx, Paul L. Heremans, Daniel Coppee, Reiner Windisch, Gustaaf Borghs, Maarten Kuijk

Proceedings Volume 3491, 1998 International Conference on Applications of Photonic Technology III: Closing the Gap between Theory, Development, and Applications; (1998) https://doi.org/10.1117/12.328743
Event: 1998 International Conference on Applications of Photonic Technology, 1998, Ottawa, Canada

Abstract

We propose a simple, low cost, parallel optical data bus for CMOS to CMOS optical interconnects. At the light emission side, NRC-LEDs are chosen for their high external quantum efficiency at low currents (10 - 20% at sub-mA level), their expected high yield and temperature insensitive operation. Image Fiber Bundles (IFBs) are the medium of choice for conducting the high number of parallel light channels. IFBs are a mature product of glass technology, being at the same time flexible, low cost, low risk and highly efficient. Light is received directly in CMOS, using the concept of Spatially Modulated Light detection in combination with a Sense-Amplifier receiver at a bitrate of 180 Mbit/s.

Citation Download Citation

Roger A. Vounckx, Paul L. Heremans, Daniel Coppee, Reiner Windisch, Gustaaf Borghs, and Maarten Kuijk "Optical chips interconnects: economically viable", Proc. SPIE 3491, 1998 International Conference on Applications of Photonic Technology III: Closing the Gap between Theory, Development, and Applications, (4 December 1998); https://doi.org/10.1117/12.328743

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