Paper
26 July 1999 Process issues of sub-0.20-μm contact hole patterns for logic devices and DRAM
Hyun-Jo Yang, Jin Young Yoon, Goo-Min Jeong, Hoon Huh, Jaejeong Kim
Author Affiliations +
Abstract
There are a number of process issues to take into account for patterning sub-0.20micrometers contact holes with optical lithography for Logic device or/and DRAM. Some of the most critical factors for patterning sub-0.20micrometers contact holes are discussed.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hyun-Jo Yang, Jin Young Yoon, Goo-Min Jeong, Hoon Huh, and Jaejeong Kim "Process issues of sub-0.20-μm contact hole patterns for logic devices and DRAM", Proc. SPIE 3679, Optical Microlithography XII, (26 July 1999); https://doi.org/10.1117/12.354389
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Cited by 1 scholarly publication.
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KEYWORDS
Photomasks

Optical lithography

Logic devices

Deep ultraviolet

Etching

Semiconducting wafers

Chemical mechanical planarization

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