Comparative analysis of silicon wafer micromachining versus nonconventional technology

Dumitru Gh. Ulieru

doi:10.1117/12.364215

20 September 1999 Comparative analysis of silicon wafer micromachining versus nonconventional technology

Dumitru Gh. Ulieru

Proceedings Volume 3822, Computer-Controlled Microshaping; (1999) https://doi.org/10.1117/12.364215
Event: Industrial Lasers and Inspection (EUROPTO Series), 1999, Munich, Germany

Abstract

In very large scale of integration processing photolithographic techniques control the patterning of thin film and the deposition of dopant used to make transistor gates and metal contacts. Microelectromechanical systems (MEMS) processing uses the same techniques to create structural components that are essentially submillimeter- sized machines parts. These parts usually require post- fabrication processing or assembly in order to become finished devices. MEMS technology can generally be categorized into two groups as bulk and surface micromachining. These categories respect not only different fabrication processes but different post fabrication techniques for finishing the mechanical subsystem.

Citation Download Citation

Dumitru Gh. Ulieru "Comparative analysis of silicon wafer micromachining versus nonconventional technology", Proc. SPIE 3822, Computer-Controlled Microshaping, (20 September 1999); https://doi.org/10.1117/12.364215

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