High-resolution contact lithography by excimer lasers

Huijie Huang; Dunwu Lu; Longlong Du; Yongkai Zhao; Cailai Yuan; Baocai Jiang; Runwen Wang

doi:10.1117/12.405742

6 November 2000 High-resolution contact lithography by excimer lasers

Huijie Huang, Dunwu Lu, Longlong Du, Yongkai Zhao, Cailai Yuan, Baocai Jiang, Runwen Wang

Proceedings Volume 4088, First International Symposium on Laser Precision Microfabrication; (2000) https://doi.org/10.1117/12.405742
Event: First International Symposium on Laser Precision Microfabrication (LPM2000), 2000, Omiya, Saitama, Japan

Abstract

High-resolution contact lithography was conducted by both 248-nm KrF and 193-nm ArF excimer lasers on PMMA resist. The resist thickness is about 0.5 (mu) . Resolution of 0.5- (mu) lines and spaces was obtained on PMMA resist after KrF excimer laser exposure and subsequent wet development. No self-developing photoetching was observed. However, with ArF excimer laser as the exposure light source, resolution of 0.3-(mu) lines and spaces was obtained on the same resist by direct photoetching under high exposure dose combined with subsequent conventional wet developing process.

Citation Download Citation

Huijie Huang, Dunwu Lu, Longlong Du, Yongkai Zhao, Cailai Yuan, Baocai Jiang, and Runwen Wang "High-resolution contact lithography by excimer lasers", Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); https://doi.org/10.1117/12.405742

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