Inorganic-organic hybrid material for lithography

Lin Pang; Yingbai Yan; Guofan Jin; Minxian Wu

doi:10.1117/12.405743

6 November 2000 Inorganic-organic hybrid material for lithography

Lin Pang, Yingbai Yan, Guofan Jin, Minxian Wu

Proceedings Volume 4088, First International Symposium on Laser Precision Microfabrication; (2000) https://doi.org/10.1117/12.405743
Event: First International Symposium on Laser Precision Microfabrication (LPM2000), 2000, Omiya, Saitama, Japan

Abstract

Tetraethoxyorthosilicate and methacryloxypropyl trimethoxy silane are used to form inorganic and organic networks, respectively. Photosensitive agent is added to initiate free-radical cross-linking polymerization of unsaturated carbon bonds and thus makes the material act as a negative tone photoresist. Developed in dilute base solution, micro- optical element, such as lenses and gratings, were fabricated by contact with UV-exposure. Shrinkage effect is investigated after optical elements obtained. Compared with the mask, the spacing of the exposed areas in sol-gel film shrinks, and the shrinkage rate is about 20%.

Citation Download Citation

Lin Pang, Yingbai Yan, Guofan Jin, and Minxian Wu "Inorganic-organic hybrid material for lithography", Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); https://doi.org/10.1117/12.405743

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