Paper
11 July 2002 Technology for low-lost and high-volume optical device packaging
Kazuhiko Kurata, Nobuharu Kami, Kazunori Miyoshi, Takara Sugimoto, Kei Tanaka, Satoshi Dhomae
Author Affiliations +
Proceedings Volume 4870, Active and Passive Optical Components for WDM Communications II; (2002) https://doi.org/10.1117/12.475561
Event: ITCom 2002: The Convergence of Information Technologies and Communications, 2002, Boston, MA, United States
Abstract
Hybrid integration of optical and electrical components (opt-electronic hybrid integration) leads to great progress in low cost and high volume optical packaging. We have developed various types of opt-electronic hybrid integration Tx/Rx module. Recently, demand for transmission speed is increasing up to 10 Gbps in Metro, LAN networks. A new packaging technique is now requested to realize lower cost and high speed. This paper presents the advance of the opt-electronic hybrid integration technology. A new packaging platform is proposed after revealing the present opt-electronic hybrid integration Tx/Rx module, and the prototype 10G-Ether modules are introduced as a trial
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kazuhiko Kurata, Nobuharu Kami, Kazunori Miyoshi, Takara Sugimoto, Kei Tanaka, and Satoshi Dhomae "Technology for low-lost and high-volume optical device packaging", Proc. SPIE 4870, Active and Passive Optical Components for WDM Communications II, (11 July 2002); https://doi.org/10.1117/12.475561
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KEYWORDS
Silicon

Packaging

Ceramics

Integrated optics

Optical alignment

Optical mounts

Optical components

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