Shape-memory alloy overload protection device for osseointegrated transfemoral implant prosthetic limb attachment system

Wei Xu; Fei Shao; Steven Hughes

doi:10.1117/12.480371

13 November 2002 Shape-memory alloy overload protection device for osseointegrated transfemoral implant prosthetic limb attachment system

Wei Xu, Fei Shao, Steven Hughes

Author Affiliations +

Proceedings Volume 4934, Smart Materials II; (2002) https://doi.org/10.1117/12.480371
Event: SPIE's International Symposium on Smart Materials, Nano-, and Micro- Smart Systems, 2002, Melbourne, Australia

Abstract

The osseointegrated trans-femoral implant system provides a direct anchoring technique to attach prosthetic limb. This technique was first introduced PI Brenmark in Sweden. The UK had the first clinical trial in 1997 and currently has 6 active limb wearers. The success of this procedure has the potential for improved gait function and mobility, increased employability and significant long-term improvements in the quality of life for above knee amputees. However, the significant load involved in the trans-femoral implant system has caused permanent deformation and/or fractures of the implant abutment in several occasions. To protect the implant system, the implant abutment in particularly, an overloading protection device was introduced. The device uses mechanical mechanism to release torsion overload on the abutment. However, the bending overload protection remains unsolved. To solve the problem, a new overload protection device was developed. This device uses SMA component for bending overload protection. In this paper, the results of non-linear finite element modelling of the SMA and steel (AISI 1040) components were presented. Experiments were also carried out using steel components to assess the design which is based on the non-linear property of the materials.

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Wei Xu, Fei Shao, and Steven Hughes "Shape-memory alloy overload protection device for osseointegrated transfemoral implant prosthetic limb attachment system", Proc. SPIE 4934, Smart Materials II, (13 November 2002); https://doi.org/10.1117/12.480371

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