Paper
30 December 2003 Wall shear stress and pressure sensor development for active control of flow
Dimitrios M. Tsamados, Delphine Meunier, Mourad Laghrouche, Jumana Boussey, Sedat F. Tardu
Author Affiliations +
Abstract
In this paper we present a technology for wall shear stress and pressure integrated sensor fabrication. Thanks to the use of SOI wafers and wafer bonding technique, we came up with an innovative technology that provides high on-chip density of sensors required for arrays utilized in numerous microfluidic applications like active control of flow. At the end some wall shear stress results are presented.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dimitrios M. Tsamados, Delphine Meunier, Mourad Laghrouche, Jumana Boussey, and Sedat F. Tardu "Wall shear stress and pressure sensor development for active control of flow", Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); https://doi.org/10.1117/12.524533
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KEYWORDS
Sensors

Semiconducting wafers

Silicon

Resistance

Etching

Calibration

Finite element methods

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