Waveguide design and fabrication of trench for hybrid integrated optic devices

Suntae Jung; Jeong Hwan Song; Kyoung-Youm Kim; Yunkyung Oh

doi:10.1117/12.591475

31 March 2005 Waveguide design and fabrication of trench for hybrid integrated optic devices

Suntae Jung, Jeong Hwan Song, Kyoung-Youm Kim, Yunkyung Oh

Proceedings Volume 5728, Integrated Optics: Devices, Materials, and Technologies IX; (2005) https://doi.org/10.1117/12.591475
Event: Integrated Optoelectronic Devices 2005, 2005, San Jose, California, United States

Abstract

The hybrid integration of passive and optoelectronic devices has been widely researched. One of the main applications of this technique is for the fiber to the home (FTTH) network. In bi-directional transceivers, integrated WDM filters have been used to separate or combine the optical signals. Thin film filter (TFF) embedded waveguide type is effective for an application requiring wide bandwidth and low loss. Although the insertion loss of TFF itself is quite low, significant loss occurs at the trench and it depends on the geometrical structure and fabrication errors of the trench waveguide. The conventional sawing method and deep reactive ion etching technique were used for trench fabrication. In the case of using DRIE process, fabrication error was reduced and position error of the trench was controlled within 1um. This method could also enhance the platform design flexibility. To reduce the coupling loss between input and reflection waveguides with high tolerance of filter position, a few mode waveguide and horn waveguide were proposed. The insertion losses of transmission and reflection were less than 0.5dB and 0.7dB respectively. The 1dB tolerance of filter position was improved to be nearly twice than that of the conventional waveguide.

Citation Download Citation

Suntae Jung, Jeong Hwan Song, Kyoung-Youm Kim, and Yunkyung Oh "Waveguide design and fabrication of trench for hybrid integrated optic devices", Proc. SPIE 5728, Integrated Optics: Devices, Materials, and Technologies IX, (31 March 2005); https://doi.org/10.1117/12.591475

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