Paper
9 June 2006 Factors affecting the surface shape and removal rate of workpiece in CMP
Quantang Fan, Jianqiang Zhu, Baoan Zhang, Weixing Shen
Author Affiliations +
Proceedings Volume 6149, 2nd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 61491Q (2006) https://doi.org/10.1117/12.674252
Event: 2nd International Symposium on Advanced Optical Manufacturing and Testing Technologies, 2005, Xian, China
Abstract
The factors affecting the removal rate and surface shape in CMP is introduced. The edge effect is a critical problem in CMP process, which behaves on the global planarization of workpiece-pad interface and change on local planarization and results in collapse or rise in workpiece edges. One of the main factors of edge effect is Von Mises stress, which is a composition stress. The main affecting factor of Von Mises is the axial stress component. The factors affecting the material removal rate (MRR) of workpiece surface and surface nonuniformity include shape, material properties and thickness of pad and polishing media. Factors of load and relative velocity in CMP are also discussed.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Quantang Fan, Jianqiang Zhu, Baoan Zhang, and Weixing Shen "Factors affecting the surface shape and removal rate of workpiece in CMP", Proc. SPIE 6149, 2nd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 61491Q (9 June 2006); https://doi.org/10.1117/12.674252
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KEYWORDS
Polishing

Surface finishing

Chemical mechanical planarization

Interfaces

Semiconducting wafers

Finite element methods

Mechanics

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