Development of nondestructive testing/evaluation methodology for MEMS

James L. Zunino III; Donald R. Skelton; Ryan T. Marinis; Adam R. Klempner; Peter Hefti; Ryszard J. Pryputniewicz

doi:10.1117/12.759659

18 February 2008 Development of nondestructive testing/evaluation methodology for MEMS

James L. Zunino III, Donald R. Skelton, Ryan T. Marinis, Adam R. Klempner, Peter Hefti, Ryszard J. Pryputniewicz

Proceedings Volume 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII; 688407 (2008) https://doi.org/10.1117/12.759659
Event: MOEMS-MEMS 2008 Micro and Nanofabrication, 2008, San Jose, California, United States

Abstract

Development of MEMS constitutes one of the most challenging tasks in today's micromechanics. In addition to design, analysis, and fabrication capabilities, this task also requires advanced test methodologies for determination of functional characteristics of MEMS to enable refinement and optimization of their designs as well as for demonstration of their reliability. Until recently, this characterization was hindered by lack of a readily available methodology. However, using recent advances in photonics, electronics, and computer technology, it was possible to develop a NonDestructive Testing (NDT) methodology suitable for evaluation of MEMS. In this paper, an optoelectronic methodology for NDT of MEMS is described and its application is illustrated with representative examples; this description represents work in progress and the results are preliminary. This methodology provides quantitative full-field-of-view measurements in near real-time with high spatial resolution and nanometer accuracy. By quantitatively characterizing performance of MEMS, under different vibration, thermal, and other operating conditions, specific suggestions for their improvements can be made. Then, using the methodology, we can verify the effects of these improvements. In this way, we can develop better understanding of functional characteristics of MEMS, which will ensure that they are operated at optimum performance, are durable, and are reliable.

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James L. Zunino III, Donald R. Skelton, Ryan T. Marinis, Adam R. Klempner, Peter Hefti, and Ryszard J. Pryputniewicz "Development of nondestructive testing/evaluation methodology for MEMS", Proc. SPIE 6884, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VII, 688407 (18 February 2008); https://doi.org/10.1117/12.759659

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KEYWORDS

Microelectromechanical systems

Nondestructive evaluation

Fringe analysis

Optoelectronics

Finite element methods

Reliability

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