Paper
27 September 2008 TEC-less operation of 384 × 288/25 μm uncooled infrared detector
J. L. Tissot, M. Vilain, O. Legras, C. Minassian, V. Fieque, Jean-Marc Chiappa
Author Affiliations +
Abstract
The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from an amorphous silicon layer enables ULIS to develop 384 × 288 (1/4 VGA) IRFPA format with 25 μm pixel-pitch designed for low end application. This detector has kept all the innovations developed on the full TV format ROIC (detector configuration by serial link, low power consumption or wide electrical dynamic range...). The specific appeal of this unit lies in the miniaturization of the TEC-less (Thermo-Electric Cooler) package and its extremely light weight. The reduction of the pixel-pitch and the innovative package turn this array into a low cost product well adapted for mass production.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. L. Tissot, M. Vilain, O. Legras, C. Minassian, V. Fieque, and Jean-Marc Chiappa "TEC-less operation of 384 × 288/25 μm uncooled infrared detector", Proc. SPIE 7100, Optical Design and Engineering III, 710029 (27 September 2008); https://doi.org/10.1117/12.797183
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KEYWORDS
Sensors

Amorphous silicon

Readout integrated circuits

Infrared detectors

Temperature metrology

Analog electronics

Bolometers

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