Paper
9 February 2009 Fine leak batch testing of multiple MEMS packages
Changsoo Jang, Byeng Dong Youn, Suk-Jin Ham, Bongtae Han
Author Affiliations +
Abstract
An analysis method for fine leak batch testing is developed for effective hermeticity inspection of metal-sealed MEMS packages in a mass production environment. It employs a forward-stepwise regression analysis based on a physical gas flow model to infer the information of leaky packages from batch test data. The proposed method can determine accurately the number of leaky packages and the true leak rate of each leaky package when the number of leaky packages in a batch is less than 5. A top-down hierarchical batch test is proposed as a reliable and effective test scheme by addressing this limitation of the developed analysis scheme.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Changsoo Jang, Byeng Dong Youn, Suk-Jin Ham, and Bongtae Han "Fine leak batch testing of multiple MEMS packages", Proc. SPIE 7206, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices VIII, 720605 (9 February 2009); https://doi.org/10.1117/12.810004
Lens.org Logo
CITATIONS
Cited by 1 scholarly publication.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Helium

Data modeling

Microelectromechanical systems

Diffusion

Inspection

Analytical research

Error analysis

Back to Top