Design and fabrication of mode size adapter using hybrid imprint lithography

Se-Hwan Sim; Han-Hyong Kim; Seung-Kook Yang; Hai-Joong Park; Seong-Jong Kim; Beom-Hoan O; Seung-Gol Lee; El-Hang Lee; Se-Geun Park

doi:10.1117/12.811958

10 February 2009 Design and fabrication of mode size adapter using hybrid imprint lithography

Se-Hwan Sim, Han-Hyong Kim, Seung-Kook Yang, Hai-Joong Park, Seong-Jong Kim, Beom-Hoan O, Seung-Gol Lee, El-Hang Lee, Se-Geun Park

Author Affiliations +

Proceedings Volume 7219, Optoelectronic Integrated Circuits XI; 72190X (2009) https://doi.org/10.1117/12.811958
Event: SPIE OPTO: Integrated Optoelectronic Devices, 2009, San Jose, California, United States

Abstract

Mode size adapters that are needed to interconnect two planar waveguides of different sizes have been designed and fabricated by the imprinting lithography. Optimum dimensions of the adapters were determined by simulation. The input port of the mode size adapters has fixed cross section size of 10 μm wide and 7 μm height. From the simulation results, the output port should have the lowest optical loss at 5μm in height and 8μm in width. Molds for the imprint were prepared by noble hybrid imprint lithography which employed both imprinting and photolithography and fabrication of mode size adapters with smooth and sloped taper region was successfully demonstrated.

Citation Download Citation

Se-Hwan Sim, Han-Hyong Kim, Seung-Kook Yang, Hai-Joong Park, Seong-Jong Kim, Beom-Hoan O, Seung-Gol Lee, El-Hang Lee, and Se-Geun Park "Design and fabrication of mode size adapter using hybrid imprint lithography", Proc. SPIE 7219, Optoelectronic Integrated Circuits XI, 72190X (10 February 2009); https://doi.org/10.1117/12.811958

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