Study on the soft defects related to dry etch process of phase shift mask

Young-Jin An; Jong-Min Kim; Byung-Sun Kang; Dong-Heok Lee; Sang-Soo Choi

doi:10.1117/12.896776

13 October 2011 Study on the soft defects related to dry etch process of phase shift mask

Young-Jin An, Jong-Min Kim, Byung-Sun Kang, Dong-Heok Lee, Sang-Soo Choi

Proceedings Volume 8166, Photomask Technology 2011; 81661L (2011) https://doi.org/10.1117/12.896776
Event: SPIE Photomask Technology, 2011, Monterey, California, United States

Abstract

In mask manufacturing process, some soft defects generated through co-interaction of dry etch and PR coating are hard to be removed in the conventional cleaning or repair process. It is on MoSi layer with smooth surface (lower roughness than MoSi), very thin and higher transmittance than MoSi film, it looks like half-tone pin-hole. Also, the defects are hard to detect in the conventional PSM inspection tool because of its thin and higher transmittance. In this paper, the root cause and control method of dry etch related half-tone pin-hole like soft defect is studied.

Citation Download Citation

Young-Jin An, Jong-Min Kim, Byung-Sun Kang, Dong-Heok Lee, and Sang-Soo Choi "Study on the soft defects related to dry etch process of phase shift mask", Proc. SPIE 8166, Photomask Technology 2011, 81661L (13 October 2011); https://doi.org/10.1117/12.896776

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available