Assembly processes comparison for a miniaturized laser used for the Exomars European Space Agency mission

Pol Ribes-Pleguezuelo; Andoni Moral Inza; Marta Gilaberte Basset; Pablo Rodríguez; Gemma Rodríguez; Marco Laudisio; Miguel Galan; Marcel Hornaff; Erik Beckert; Ramona Eberhardt; Andreas Tünnermann

doi:10.1117/1.OE.55.11.116107

22 November 2016 Assembly processes comparison for a miniaturized laser used for the Exomars European Space Agency mission

Pol Ribes-Pleguezuelo, Andoni Moral Inza, Marta Gilaberte Basset, Pablo Rodríguez, Gemma Rodríguez, Marco Laudisio, Miguel Galan, Marcel Hornaff, Erik Beckert, Ramona Eberhardt, Andreas Tünnermann

Author Affiliations +

Optical Engineering, Vol. 55, Issue 11, 116107 (November 2016). https://doi.org/10.1117/1.OE.55.11.116107

Abstract

A miniaturized diode-pumped solid-state laser (DPSSL) designed as part of the Raman laser spectrometer (RLS) instrument for the European Space Agency (ESA) Exomars mission 2020 is assembled and tested for the mission purpose and requirements. Two different processes were tried for the laser assembling: one based on adhesives, following traditional laser manufacturing processes; another based on a low-stress and organic-free soldering technique called solderjet bumping technology. The manufactured devices were tested for the processes validation by passing mechanical, thermal cycles, radiation, and optical functional tests. The comparison analysis showed a device improvement in terms of reliability of the optical performances from the soldered to the assembled by adhesive-based means.

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Pol Ribes-Pleguezuelo, Andoni Moral Inza, Marta Gilaberte Basset, Pablo Rodríguez, Gemma Rodríguez, Marco Laudisio, Miguel Galan, Marcel Hornaff, Erik Beckert, Ramona Eberhardt, and Andreas Tünnermann "Assembly processes comparison for a miniaturized laser used for the Exomars European Space Agency mission," Optical Engineering 55(11), 116107 (22 November 2016). https://doi.org/10.1117/1.OE.55.11.116107

Published: 22 November 2016

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