Vacuum Methods For Layer Deposition And Application To Device Structures

Aristos Christou

doi:10.1117/12.934985

8 November 1983 Vacuum Methods For Layer Deposition And Application To Device Structures

Aristos Christou

Proceedings Volume 0387, Technology of Stratified Media; (1983) https://doi.org/10.1117/12.934985
Event: 1983 Los Angeles Technical Symposium, 1983, Los Angeles, United States

Abstract

This paper reviews the deposition methode of single element metallic films, refractory films, silicides, vacuum epitaxy of metallic films, silicon and GaAs. The vacuum deposition techniques are: rf sputtering, magnetron sputtering, e-beam deposition, vacuum epitaxy and molecular beam epitaxy. Finally, the application of these films to microwave devices and integrated circuits is reviewed.

Citation Download Citation

Aristos Christou "Vacuum Methods For Layer Deposition And Application To Device Structures", Proc. SPIE 0387, Technology of Stratified Media, (8 November 1983); https://doi.org/10.1117/12.934985

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