Paper
11 August 1987 A High Fiber Density Optical Connector For Use In Electronic Packaging Systems
W. J. Parzygnat
Author Affiliations +
Proceedings Volume 0752, Digital Optical Computing; (1987) https://doi.org/10.1117/12.939930
Event: OE LASE'87 and EO Imaging Symposium, 1987, Los Angeles, CA, United States
Abstract
A through-the-backplane, circuit pack optical connector, utilizing a novel alignment mechani3m, is described. Up to 13 fibers can be interconnected in a space of 0.5" x 0.6" x 2.26". Average loss is 0.53 dB with 50/125 fiber. Laboratory tests with single mode fiber (8.3/125) in a modified connector have shown an average loss of about 0.7dB. All measurements were made without index matching material.
© (1987) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W. J. Parzygnat "A High Fiber Density Optical Connector For Use In Electronic Packaging Systems", Proc. SPIE 0752, Digital Optical Computing, (11 August 1987); https://doi.org/10.1117/12.939930
Lens.org Logo
CITATIONS
Cited by 10 scholarly publications and 1 patent.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Connectors

Silicon

Packaging

Humidity

Single mode fibers

Custom fabrication

Distance measurement

RELATED CONTENT

Assembly and performance of silicone polymer waveguides
Proceedings of SPIE (March 15 2016)
Back-illuminated CCD mosaics
Proceedings of SPIE (April 10 1995)
Rugged hermaphroditic single-terminus connector
Proceedings of SPIE (February 01 1992)

Back to Top