Processing Photostructural Materials

David J. Rosenblatt; Jay N. Zemel; Wayne E . Feely

doi:10.1117/12.940321

25 August 1987 Processing Photostructural Materials

David J. Rosenblatt, Jay N. Zemel, Wayne E . Feely

Proceedings Volume 0771, Advances in Resist Technology and Processing IV; (1987) https://doi.org/10.1117/12.940321
Event: Microlithography Conferences, 1987, Santa Clara, CA, United States

Abstract

Results are presented on a resin system that can be crosslinked to yield 3D negative images that are thermally stable to temperatures greater than 300°C. The conditions needed to process films up to 1511m thick were studied. To produce microstructures in these thick films the exposure intensity must be controlled to allow adequate time for nitrogen gas, released by the diazoquinone sensitizer, to diffuse from the image region before super-saturation levels nucleate bubble defects.

Citation Download Citation

David J. Rosenblatt, Jay N. Zemel, and Wayne E . Feely "Processing Photostructural Materials", Proc. SPIE 0771, Advances in Resist Technology and Processing IV, (25 August 1987); https://doi.org/10.1117/12.940321

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