Laser Interferometric Method For The Measurement Of Film Thickness, Using Holographic Optical Components

K. Matsuda; M. Namiki

doi:10.1117/12.968846

16 January 1988 Laser Interferometric Method For The Measurement Of Film Thickness, Using Holographic Optical Components

K. Matsuda, M. Namiki

Author Affiliations +

Proceedings Volume 0952, Laser Technologies in Industry; (1988) https://doi.org/10.1117/12.968846
Event: Laser Technologies in Industry, 1988, Porto, Portugal

Abstract

An interference method for determination of the thickness of thin dielectric films deposited on metal substrates is described. The method uses the variation of multiple-beam interference of light reflected from the sample as the incident angle is changed. The effects of the phase change on reflection at the metal/dielectric interface are shown to be negligible for a MgF₂ film deposited on Chromium. A working instrument is described which uses holographic lenses to obtain the large scan angles required with low aberration. The results obtained with this instrument agree well with those obtained using a Talysurf.

Citation Download Citation

K. Matsuda and M. Namiki "Laser Interferometric Method For The Measurement Of Film Thickness, Using Holographic Optical Components", Proc. SPIE 0952, Laser Technologies in Industry, (16 January 1988); https://doi.org/10.1117/12.968846

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