Investigation on spin-on hard mask integration

Yushin Park; Seungwook Shin; Yunjun Kim; Seunghyun Kim; Jaebum Lim; Sung Hwan Kim; Hyeonil Jung; Chungheon Lee; Miyeon Han; Sanghak Lim; Jeong Yun Yu

doi:10.1117/12.2257846

27 March 2017 Investigation on spin-on hard mask integration

Yushin Park, Seungwook Shin, Yunjun Kim, Seunghyun Kim, Jaebum Lim, Sung Hwan Kim, Hyeonil Jung, Chungheon Lee, Miyeon Han, Sanghak Lim, Jeong Yun Yu

Author Affiliations +

Proceedings Volume 10146, Advances in Patterning Materials and Processes XXXIV; 1014616 (2017) https://doi.org/10.1117/12.2257846
Event: SPIE Advanced Lithography, 2017, San Jose, California, United States

Abstract

For fine patterning, there are two possible hard mask integration schemes: quad-layer and tri-layer systems. Due to the different structures and processes between quad- and tri- layer systems, each system needs specific chemical and physical properties of the hard mask. In this paper, we report the properties of the carbon-based spin-on hard mask (CSOH) candidates for various hard mask integrations.

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Yushin Park, Seungwook Shin, Yunjun Kim, Seunghyun Kim, Jaebum Lim, Sung Hwan Kim, Hyeonil Jung, Chungheon Lee, Miyeon Han, Sanghak Lim, and Jeong Yun Yu "Investigation on spin-on hard mask integration", Proc. SPIE 10146, Advances in Patterning Materials and Processes XXXIV, 1014616 (27 March 2017); https://doi.org/10.1117/12.2257846

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