Ultra-fine grinding of silicate materials under the use of new resin bond diamond tools

Sebastian Henkel; Jens Bliedtner; Edda Rädlein; Christian Schulze; Matthias Rost; Martin Gerhardt; Michael Fuhr

doi:10.1117/12.2269500

15 June 2017 Ultra-fine grinding of silicate materials under the use of new resin bond diamond tools

Sebastian Henkel, Jens Bliedtner, Edda Rädlein, Christian Schulze, Matthias Rost, Martin Gerhardt, Michael Fuhr

Proceedings Volume 10326, Fourth European Seminar on Precision Optics Manufacturing; 1032605 (2017) https://doi.org/10.1117/12.2269500
Event: Fourth European Seminar on Precision Optics Manufacturing, 2017, Teisnach, Germany

Abstract

The fabrication of high-quality optical components involves great effort. Polishing often functions as the final step in a manufacturing chain. To reduce the conventionally time-consuming, complex polishing process with loose grain, an interesting approach with novel resin bond grinding tools is presented for surface smoothing. Various processing-experiments were carried out, regarding different silicate materials such as BK7® and fused silica. Among other results it is shown, that good surface qualities with low roughness down to R_a = 8 nm or R_q = 10 nm can be achieved so far, a quality that already allows speaking of “ultra-fine” grinding. This results in remarkable possibilities to reduce conventional fine-machining procedures with loose abrasives. The fine grinded components can directly be polished to finally smooth the surface and remove remaining defects. Total-processing-times can be strongly reduced, involving significant economic advantages.

Citation Download Citation

Sebastian Henkel, Jens Bliedtner, Edda Rädlein, Christian Schulze, Matthias Rost, Martin Gerhardt, and Michael Fuhr "Ultra-fine grinding of silicate materials under the use of new resin bond diamond tools", Proc. SPIE 10326, Fourth European Seminar on Precision Optics Manufacturing, 1032605 (15 June 2017); https://doi.org/10.1117/12.2269500

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