Lifetime estimation of extreme-ultraviolet pellicle at 500 W source power by thermal stress analysis

Eun-Sang Park; Chung-Hyun Ban; Jae-Hun Park; Hye-Keun Oh

doi:10.1117/12.2280518

16 October 2017 Lifetime estimation of extreme-ultraviolet pellicle at 500 W source power by thermal stress analysis

Eun-Sang Park, Chung-Hyun Ban, Jae-Hun Park, Hye-Keun Oh

Proceedings Volume 10450, International Conference on Extreme Ultraviolet Lithography 2017; 104501K (2017) https://doi.org/10.1117/12.2280518
Event: SPIE Photomask Technology and EUV Lithography, 2017, Monterey, California, United States

Abstract

The analysis of the thermal stress and the extreme-ultraviolet (EUV) pellicle is important since the pellicle could be easily damaged since the thickness of the pellicle is 50 nm thin due to 90% required EUV transmission. One of the solution is using a high emissivity metallic material on the both sides of the pellicle and it can lower the thermal stress. However, using a metallic coating on pellicle core which is usually consist of silicon group can decrease the EUV transmission compared to using a single core layer pellicle only. Therefore, we optimized thermal and optical properties of the pellicle and elect three types of the pellicle. In this paper we simulated our optimized pellicles with 500W source power. The result shows that the difference of the thermal stress is small for each case. Therefore, our result also shows that using a high emissivity coating is necessary since the cooling of the pellicle strongly depends on emissivity and it can lower the stress effectively even at high EUV source power.

Citation Download Citation

Eun-Sang Park, Chung-Hyun Ban, Jae-Hun Park, and Hye-Keun Oh "Lifetime estimation of extreme-ultraviolet pellicle at 500 W source power by thermal stress analysis", Proc. SPIE 10450, International Conference on Extreme Ultraviolet Lithography 2017, 104501K (16 October 2017); https://doi.org/10.1117/12.2280518

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