Paper
20 February 2018 Mechanisms of resistance change under pressure for AgNP-based conducting wires
Author Affiliations +
Proceedings Volume 10697, Fourth Seminar on Novel Optoelectronic Detection Technology and Application; 106974Z (2018) https://doi.org/10.1117/12.2315465
Event: Fourth Seminar on Novel Optoelectronic Detection Technology and Application, 2017, Nanjing, China
Abstract
The silver nanoparticle (AgNP) based conducting wire is a fundamental element of flexible electronic devices, especially in the printing electronics area. Its resistance change mechanisms under pressure is of both scientific interest and practical importance. AgNP-based conducting wires were fabricated on flexible substrates by electrospraying printing technology, and three possible resistance change mechanisms were studied: vertical deformation (VD) of the AgNP wire due to vertical pressure, horizontal wire elongation (HWE) along with the flexible substrate due to vertical pressure, and local micro deformation (LMD) at the touching edge. Analysis of the experiment data revealed that the resistance change due to VD was negligible, the resistance change due to PWE was one order of magnitude smaller than the measured value, and the resistance change due to PWE was the dominating mechanism.
© (2018) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zhentao Qian, Liping Liu, Han Huang, Xiong Cheng, Xiaobo Zhu, and Wenhua Gu "Mechanisms of resistance change under pressure for AgNP-based conducting wires", Proc. SPIE 10697, Fourth Seminar on Novel Optoelectronic Detection Technology and Application, 106974Z (20 February 2018); https://doi.org/10.1117/12.2315465
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KEYWORDS
Resistance

Flexible circuits

Silver

Aerospace engineering

Nanoparticles

Particles

Printing

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