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17 September 2018 Additive nanomanufacturing of metallic nanostructures through a kick-and-place approach (Conference Presentation)
Chenglong Zhao
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Proceedings Volume 10722, Plasmonics: Design, Materials, Fabrication, Characterization, and Applications XVI; 107221H (2018) https://doi.org/10.1117/12.2319898
Event: SPIE Nanoscience + Engineering, 2018, San Diego, California, United States
Abstract
We investigated a mechanism for quick release and transfer of gold nanoparticles (GNPs) from a soft substrate to another substrate under laser illumination. The heating of GNPs on a soft substrate with a continuous-wave laser causes a rapid thermal expansion of the substrate, which can be used to selectively release and place GNPs onto another surface. In-plane and out-of-plane nanostructures are successfully fabricated using this method. This rapid release-and-place process can be used for additive nonmanufacturing of metallic nanostructures under ambient conditions, which paves a way for affordable nanomanufacturing and enables a wide variety of applications in nanophotonics, ultrasensitive sensing, and nonlinear plasmonics.
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Chenglong Zhao "Additive nanomanufacturing of metallic nanostructures through a kick-and-place approach (Conference Presentation)", Proc. SPIE 10722, Plasmonics: Design, Materials, Fabrication, Characterization, and Applications XVI, 107221H (17 September 2018); https://doi.org/10.1117/12.2319898
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KEYWORDS
Nanostructures
Additive manufacturing
Continuous wave operation
Gold
Nanolithography
Nanoparticles
Nanophotonics
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