Leveraging wafer-level manufacturing process limitations to increase large-scale fused silica microlens array uniformity

Raoul Kirner; Jeremy Béguelin; Wilfried Noell; Martin Eisner; Toralf Scharf; Reinhard Voelkel

doi:10.1117/12.2529195

30 August 2019 Leveraging wafer-level manufacturing process limitations to increase large-scale fused silica microlens array uniformity

Raoul Kirner, Jeremy Béguelin, Wilfried Noell, Martin Eisner, Toralf Scharf, Reinhard Voelkel

Author Affiliations +

Proceedings Volume 11103, Optical Modeling and System Alignment; 111030A (2019) https://doi.org/10.1117/12.2529195
Event: SPIE Optical Engineering + Applications, 2019, San Diego, California, United States

Abstract

The wafer-level production of Fused Silica microlens arrays is limited by systematic process non-uniformities. The common molten resist-reflow process with subsequent dry-etching allows for manufacturing of microlens arrays on 200 mm wafers. A thorough process review yielded one free parameter. By switching from the geometrical lens description via radius of curvature and conic constant to a functional assessment via the optical design figure of merit we can describe microlens via their optical quality for the intended application with one parameter for a wide variety of cases. Leveraging these points we show improvements on the uniformity of microlens arrays by a factor of 2 for Fused Silica microlens arrays bigger than 100 mm by 100 mm.

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Citation Download Citation

Raoul Kirner, Jeremy Béguelin, Wilfried Noell, Martin Eisner, Toralf Scharf, and Reinhard Voelkel "Leveraging wafer-level manufacturing process limitations to increase large-scale fused silica microlens array uniformity", Proc. SPIE 11103, Optical Modeling and System Alignment, 111030A (30 August 2019); https://doi.org/10.1117/12.2529195

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