2D material-integrated optoelectronics (Conference Presentation)

Volker J. Sorger

doi:10.1117/12.2548515

10 March 2020 2D material-integrated optoelectronics (Conference Presentation)

Volker J. Sorger

Proceedings Volume 11282, 2D Photonic Materials and Devices III; 112820J (2020) https://doi.org/10.1117/12.2548515
Event: SPIE OPTO, 2020, San Francisco, California, United States

Abstract

2D materials have a number of intriguing value proposition that could be harnessed for compact, tunable, high-performance optoelectronic devices when heterogeneously integrated in photonic circuits. Here I review our latest work including; (1) tunable TMD-based microring resonator with engineered critical-coupling condition, (2) a broadband graphene plasmon-slot photodetector (R=0.7A/W), (3) a 200mV bandgap-shifted strain-engineered absorption-enhanced MoTe2 photodetector (R=0.5A/W, low-dark-current <10nA@-1V), (4) a record-high responsivity (R=1.36A/W) slot-plasmon exciton-modulated MoTe2 photodetector, (5) a MoS2 electro-absorption modulator all enabled by our recently developed method of cross-contamination-free yet deterministic dry transfer 2D material ‘printer’ mimicking a 3D printer for enabling rapid prototyping. These devices are based on co-integration of 2D materials into Silicon and SiN photonics, with the latter used for on-exciton modulation or exciton absorption.

Conference Presentation

Citation Download Citation

Volker J. Sorger "2D material-integrated optoelectronics (Conference Presentation)", Proc. SPIE 11282, 2D Photonic Materials and Devices III, 112820J (10 March 2020); https://doi.org/10.1117/12.2548515

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KEYWORDS

3D printing

Electrooptic modulators

Graphene

Microrings

Optoelectronic devices

Photonic integrated circuits

Plasmons

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