|
In this paper, we report further improved thermal performance of maleimide resin called NeoFARIT N011 (in short NFN011) with lower shrinkage during curing process. The shrinkage of NFN011 in 250ºC bake is less <5% in the air although that of NFN006 reaches more than 20%. In addition, NFN011 with no additive is able to form a cured film with low shrinkage due to low sublimation, and shows better thermal stability than cured films using additives. On the other hand, NFN011, which exhibits excellent thermal stability, has a problem of low solubility in PGMEA and PGME, which are commonly used solvent in lithography processes. On this solubility issue, we newly develop NeoFARIT N012 (in short NFN012), which includes a methyl group on the maleimide moiety of NFN011. NFN012 shows both good solubility in PGMEA and sufficient thermal stability. It shows slight weight loss <5% at 450ºC in the air atmosphere on TG-DTA analysis. In addition, its shrinkage in 250ºC bake is less <5% in the air. We have succeeded in developing a new material that exhibited good solubility in PGMEA and PGME, sufficient thermal stability, and low sublimability. |
ACCESS THE FULL ARTICLE
No SPIE Account? Create one
System on a chip
Semiconducting wafers
Thin films
Coating
Lithography
Chromatography
Molecules
