Breaking stochastic tradeoffs with a dry deposited and dry developed EUV photoresist system

Rich S. Wise

doi:10.1117/12.2585004

26 February 2021 Breaking stochastic tradeoffs with a dry deposited and dry developed EUV photoresist system

Rich S. Wise

Proceedings Volume 11612, Advances in Patterning Materials and Processes XXXVIII; 1161203 (2021) https://doi.org/10.1117/12.2585004
Event: SPIE Advanced Lithography, 2021, Online Only

Abstract

We discuss here our revolutionary technique to both apply photo resist and develop latent images in photo resist using dry technologies instead of the existing wet spin coating and development that have been the standard over the last several decades. We will review the key advantages of dry resist processing over wet resist processing: stability, photo sensitivity, environmental footprint, and cost. This nascent technology has demonstrated best in class resist performance at leading edge design rules, breaks several long standing tradeoffs in EUV photoresist materials, and opens the door to a new world of innovations in EUV lithography patterning.

Conference Presentation

Citation Download Citation

Rich S. Wise "Breaking stochastic tradeoffs with a dry deposited and dry developed EUV photoresist system", Proc. SPIE 11612, Advances in Patterning Materials and Processes XXXVIII, 1161203 (26 February 2021); https://doi.org/10.1117/12.2585004

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