Paper
4 December 2020 Preparation technology of ultra thin fused silica glass sheet
Xiurong Du, Xiaoqiang Zhang, Yuancheng Sun, Xuefu Song, Jiajia Wang, Ning Hua
Author Affiliations +
Proceedings Volume 11617, International Conference on Optoelectronic and Microelectronic Technology and Application; 116171E (2020) https://doi.org/10.1117/12.2585148
Event: International Conference on Optoelectronic and Microelectronic Technology and Application, 2020, Nanjing, China
Abstract
The fused silica glass is needed in the electronics and micro manufacturing industry. The thickness requirement is 0.02 ~ 0.2mm, which is difficult to be achieved by traditional machining. In this paper, a new thinning technology is proposed. Through the combination of chemical mechanical polishing (CMP and chemical etching, ultra-thin fused silica glass with diameter of 50 mm, thickness of 0.05 mm and Ra<1 nm can be prepared. It was also found that the fused silica glass could be thinned uniformly and efficiently by high-speed rotation and adding active agent in the chemical etching process.
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xiurong Du, Xiaoqiang Zhang, Yuancheng Sun, Xuefu Song, Jiajia Wang, and Ning Hua "Preparation technology of ultra thin fused silica glass sheet", Proc. SPIE 11617, International Conference on Optoelectronic and Microelectronic Technology and Application, 116171E (4 December 2020); https://doi.org/10.1117/12.2585148
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
Back to Top