Direct optical-wire bonding: 3D writing of polymer-wire waveguides for optical interconnects

Chong Cook Kim; Myeongho Kim; Namho Kim; Jaeyeon Pyo; Jung Ho Je

doi:10.1117/12.2576765

5 March 2021 Direct optical-wire bonding: 3D writing of polymer-wire waveguides for optical interconnects

Chong Cook Kim, Myeongho Kim, Namho Kim, Jaeyeon Pyo, Jung Ho Je

Proceedings Volume 11692, Optical Interconnects XXI; 116920J (2021) https://doi.org/10.1117/12.2576765
Event: SPIE OPTO, 2021, Online Only

Abstract

The direct optical wiring (DOW) technology which is based on the 3D writing of optically transparent polymer wires using a meniscus-guided method is employed to develop multi-mode optical interconnects for VCSEL-MMF applications. This DOW method, similar in concept to conventional electrical wire bonding, does not require any chemical reactions. DOW bonding is used to optically connect high-speed VCSELs and standard OM3 multi-mode fibers (MMFs). The resulting simplified lens-free transmitter modules show a high coupling efficiency (65%) and 12 Gbit/sec error-free transmission per-channel, which is satisfactory for optical HDMI 2.1 applications. In the presentation, the 4K-60Hz performance transmitted through the HDMI2.1 will be demonstrated and extended single-mode results introduced. We believe that DOW bonding can be a powerful platform technology for optical interconnect and photonic integration for innovative industrial and academic photonic applications.

Conference Presentation

Citation Download Citation

Chong Cook Kim, Myeongho Kim, Namho Kim, Jaeyeon Pyo, and Jung Ho Je "Direct optical-wire bonding: 3D writing of polymer-wire waveguides for optical interconnects", Proc. SPIE 11692, Optical Interconnects XXI, 116920J (5 March 2021); https://doi.org/10.1117/12.2576765

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