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25 May 2022 Continuous improvement of defectivity rate and CD uniformity in immersion lithography via track co-optimization method
Jorge P. Nacenta Mendivil, Nathalie Frolet, Karine Jullian, Michael May, Yuji Tanaka, Alexis Royer, Masahiko Harumoto, Raluca Tiron
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Proceedings Volume 12055, Advances in Patterning Materials and Processes XXXIX; 120550U (2022) https://doi.org/10.1117/12.2614237
Event: SPIE Advanced Lithography + Patterning, 2022, San Jose, California, United States
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Abstract
Continuous shrinking of semiconductor manufacturing node requires smaller critical dimension (CD) and higher pattern density, but also a better control of pattern local variability such as local CD uniformity (CDU). Thus, improving the process stability has been shown to improve local variability. Shrinking makes also crucial to control the process-specific patterned defectivity, with a more demanding defect detection and removal effort, which will depend on the mask level and stack materials. Therefore, integrating a new process in a recently installed immersion lithography cluster requires a thorough study of the influence of the track parameters in the specific process flow, as well as the use of last generation optical defectivity inspection, review and classification tools. In this work, we present the main results in the cooptimization of CD control, CD uniformity and after development inspection (ADI) of defectivity in a PTD immersion lithography process. The mask used is a gate layer targeting 42nm dense lines using a trilayer with topcoat lithographic stack.
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Jorge P. Nacenta Mendivil, Nathalie Frolet, Karine Jullian, Michael May, Yuji Tanaka, Alexis Royer, Masahiko Harumoto, and Raluca Tiron "Continuous improvement of defectivity rate and CD uniformity in immersion lithography via track co-optimization method", Proc. SPIE 12055, Advances in Patterning Materials and Processes XXXIX, 120550U (25 May 2022); https://doi.org/10.1117/12.2614237
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KEYWORDS
Semiconducting wafers
System on a chip
Critical dimension metrology
Scanning electron microscopy
Inspection
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