Researching on the factors influencing the critical undeformed chip thickness of single crystal germanium

Shan-yi Ma; Hui Yang; Qian Chen; Hai-tao Yang

doi:10.1117/12.2604765

13 December 2021 Researching on the factors influencing the critical undeformed chip thickness of single crystal germanium

Shan-yi Ma, Hui Yang, Qian Chen, Hai-tao Yang

Author Affiliations +

Proceedings Volume 12072, 10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Micro- and Nano-Optics, Catenary Optics, and Subwavelength Electromagnetics; 120720S (2021) https://doi.org/10.1117/12.2604765
Event: Tenth International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2021), 2021, Chengdu, China

Abstract

Cutting in ductile mode is a prerequisite for mirror machining of single crystal brittle materials. Under the condition that the cutting thickness is less than the critical undeformed chip thickness, the single crystal brittle material is removed in ductile mode. The critical undeformed chip thickness of single crystal brittle materials is not an intrinsic parameter, but a variable related to stress conditions, crystal orientation and other factors. In this paper, aiming at the critical undeformed chip thickness of single crystal germanium, the influence of the changes of crystal orientation, tool rake angle and linear velocity on the critical undeformed chip thickness of single crystal germanium is investigated by means of constant linear velocity single point diamond turning. The experimental results show that critical undeformed chip thickness of single crystal germanium varies in different crystal orientations. Large tool negative rake angle can increase the critical undeformed chip thickness of single crystal germanium. Increasing the linear velocity within a certain range can increase the critical undeformed chip thickness of single crystal germanium, however, excessive linear velocity will worsen the cutting state and reduce the critical undeformed chip thickness. This study provides some references for ductile mode cutting of single crystal germanium and other brittle materials.

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Shan-yi Ma, Hui Yang, Qian Chen, and Hai-tao Yang "Researching on the factors influencing the critical undeformed chip thickness of single crystal germanium", Proc. SPIE 12072, 10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Micro- and Nano-Optics, Catenary Optics, and Subwavelength Electromagnetics, 120720S (13 December 2021); https://doi.org/10.1117/12.2604765

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KEYWORDS

Crystals

Germanium

Spindles

Profilometers

Single point diamond turning

Surface finishing

Optical components

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