Low stray inductance packaging technology

Maotong Yang; William Cai; Minghao Zhou; Qingbo Guo

doi:10.1117/12.2618213

29 November 2021 Low stray inductance packaging technology

Maotong Yang, William Cai, Minghao Zhou, Qingbo Guo

Proceedings Volume 12080, 4th International Symposium on Power Electronics and Control Engineering (ISPECE 2021); 120801I (2021) https://doi.org/10.1117/12.2618213
Event: 4th International Symposium on Power Electronics and Control Engineering (ISPECE 2021), 2021, Nanchang, China

Abstract

The electrical characteristics of power modules often involve parasitic parameters, and the parasitic inductance mainly depends on the metal bonding wire. The length, diameter, material, shape, and connection method of the bonding wire will affect the electrical characteristics of the power module. The parasitic capacitance mainly depends on the DBC ceramic layer. Through module division and dimensionality reduction, the effect of the width and height of the DBC on the parasitic capacitance in the planar state is briefly analyzed, which lays the foundation for the subsequent analysis of the 3D model. Parasitic inductance and parasitic capacitance together affect the size of the corner frequency in electromagnetic interference. Change the position of the upper and lower bridge arms through stacked commutation, reduce the commutation path voltage, reduce the parasitic inductance, and suppress the voltage overshoot and voltage oscillation caused by the larger current rate of change.

Citation Download Citation

Maotong Yang, William Cai, Minghao Zhou, and Qingbo Guo "Low stray inductance packaging technology", Proc. SPIE 12080, 4th International Symposium on Power Electronics and Control Engineering (ISPECE 2021), 120801I (29 November 2021); https://doi.org/10.1117/12.2618213

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